
The product on this page is the 3m (10ft) version of NVIDIA/Mellanox MCP7Y70-H003, built for 400G operation with OSFP (IHS/Finned Top) to 4x QSFP56. Its complete DAC construction simplifies the physical link, and the sections below cover the exact specification, rack-integration considerations and factory verification for this individual order code.
OEM Part Number: MCP7Y70-H003HT Part Number: MCP7Y70-H003
| HT Part Number | MCP7Y70-H003 |
|---|---|
| NVIDIA/Mellanox InfiniBand Compatible | MCP7Y70-H003 |
| Manufacturer | HT |
| Form Factor | OSFP (IHS/Finned Top) to 4x QSFP56 |
| Max. Data Rate | 400Gbps |
| Cable Length | 3m (10ft) |
| Wire AWG | 28AWG |
| Minimum Bend Radius | 30mm |
| Max. Power Consumption | 0.1W (OSFP End) 0.1W (QSFP56 Per End) |
| Media | Copper |
| Cable Type | Passive Twinax |
| Modulation Format | 8x 50G-PAM4 to Quad 2x 50G-PAM4 |
| Jacket Material | PVC (OFNR) |
| Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Protocols | OSFP MSA, IEEE 802.3cd, CMIS v4.0 |
The listed modulation format is 8x 50G-PAM4 to Quad 2x 50G-PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.
The rated power consumption is 0.1W (OSFP End) 0.1W (QSFP56 Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.
This assembly uses 28AWG conductors, PVC (OFNR) jacket, minimum bend radius 30mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.
The intended application is determined by the host interface and protocol support. Listed interface and protocol references include OSFP MSA, IEEE 802.3cd, CMIS v4.0. Confirm that the host firmware and port configuration support the same operating mode.
The OSFP (IHS/Finned Top) to 4x QSFP56 configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.
A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.
At 3m (10ft), this assembly can bridge non-aligned ports or adjacent racks while remaining a single direct-attach link. Support longer horizontal runs with suitable cable management and preserve space for cooling and future maintenance.
MCP7Y70-H003 is the longest of 6 verified length options in this family. Compared with MCP7Y70-H02A at 2.5m (8ft), it provides 0.5m of additional reach for a longer vertical drop, a wider rack or an adjacent-cabinet route. Confirm that the complete path requires this length, because unused slack still needs supported, bend-safe storage.
Select the assembly by both reach and rack layout. A direct connection removes separate module-and-patch-cord interfaces, but it still needs a bend-safe pathway and clear connector access. Keep cable bundles from blocking front-panel airflow, account for the listed interface power where applicable and choose a length that supports maintenance without leaving an unmanaged coil. For this assembly, the listed conductor specification is 28AWG; the minimum bend radius is 30mm; the stated power consumption is 0.1W (OSFP End) 0.1W (QSFP56 Per End); the jacket material is PVC (OFNR).
Each cable receives connector inspection and a functional link check before it is coiled with bend-safe slack and packed. Protective materials shield the connector housings during transport. Rack or project labels are available to keep length, part number and installation destination aligned. Volume orders can include customer references on the labels and carton list.
Provide the OEM reference, HT part number, fixed length and quantity, together with the intended host interfaces. Rack-based quantities and packaging instructions can be included for larger deployments. Other lengths are separate products and should be entered on their own order lines. Quantity and any labeling instructions should be attached specifically to MCP7Y70-H003.
Compatibility confirmation combines host identification with actual link establishment and diagnostic checks. The assembly is prepared for the stated OEM reference rather than selected only by connector shape. For a new data-center deployment, the equipment model, port mode and software release provide the most useful basis for a pre-order review. Both connectors are examined before the operating test, which includes link stability and diagnostic indications.
No. It is an HT-manufactured compatible alternative for equipment that specifies NVIDIA/Mellanox MCP7Y70-H003.
No. This is one complete direct-attach assembly. The ends are not detachable modules and should not be separated from the cable.
No. Use a supported, bend-safe service loop and observe the listed minimum bend radius. Do not crease the cable or tighten ties around the connector boots.
Not necessarily. Both hosts must support the stated rate, identification, lane mapping and any required breakout configuration; mechanical compatibility alone is insufficient.
Standard configurations normally ship within one to three working days, while production quantities are confirmed with the order. Worldwide courier services are available, with air or sea freight for consolidated shipments; freight-collect delivery and coordination with a customer’s logistics provider can be arranged.
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